Semiconductor integrated circuit and method of manufacturing same

A semiconductor integrated circuit, comprising:

• a semiconductor substrate;
• an interlayer insulating film formed on said semiconductor substrate;
• and
• a lower contact plug and an upper contact plug vertically arranged in said interlayer insulating film, said lower contact plug and said upper contact plug being connected to each other,
• wherein a lower surface of said upper contact plug has a cross-sectional dimension in a first direction smaller than a cross-sectional dimension of an upper surface of said lower contact plug in said first direction, and
• a center of said lower surface of said upper contact plug is located at a position deviated from a center of said upper surface of said lower contact plug so that connection is established between a part of said upper contact plug and a side surface of said lower contact plug.

A method of manufacturing a semiconductor integrated circuit, comprising the steps of:

• (a) forming an interlayer insulating film on a semiconductor substrate;
• (b) forming a contact plug penetrating through said interlayer insulating film to reach said semiconductor substrate;
• (c) locating said contact plug so that said contact plug protrudes from an upper main surface of said interlayer insulating film by a predetermined height;
• and
• (d) forming a conductive layer on said contact plug having a dimension in a first direction smaller than a cross-sectional dimension of an upper surface of said contact plug in said first direction and a dimension in a second direction perpendicular to said first direction larger than a cross-sectional dimension of said upper surface of said contact plug in said second direction,
• wherein said step (d) further comprises the step of locating said conductive layer so that said conductive layer is in contact with said contact plug in such a manner that a center of said conductive layer in said dimension in said first direction is at a position deviated from a center of said upper surface of said contact plug.