Method of fabricating tape attachment chip-on-board assemblies
AssigneeMicron Technology, Inc.
InventorTongbi Jiang
Life of this patent
Estimating the term…
Abstract
An apparatus and method for preventing damage to tape attachment semiconductor assemblies due to encapsulation filler particles causing damage to a semiconductor die active surface and/or to a corresponding semiconductor substrate surface by providing an adhesive tape which extends across areas of contact between the semiconductor die active surface and the semiconductor substrate. The present invention also includes extending the adhesive tape beyond the areas of contact between the semiconductor die active surface and the semiconductor substrate to provide a visible surface of visual inspection of proper adhesive tape placement.
Claims13
A method of fabricating a semiconductor die assembly having at least one substrate and at least one semiconductor die attached to said substrate for substantially preventing filler particles in said material from residing between the semiconductor die and the substrate from the encapsulation of the semiconductor die comprising:
- providing said at least one semiconductor substrate having a first surface and a second surface, said semiconductor substrate including at least one opening defined through said semiconductor substrate between said first surface of said semiconductor substrate and said second surface of said semiconductor substrate;
- providing said at least one semiconductor die having an active surface having at least one electrical connection area disposed on said active surface;
- disposing at least one adhesive tape between said semiconductor die active surface and said semiconductor substrate first surface for attaching said semiconductor die to said at least one semiconductor substrate, a width of said at least one adhesive tape extending from not less than an edge of said at least one semiconductor die to at least an edge of said at least one opening of said semiconductor substrate, said disposing at least one adhesive tape between said active surface of said semiconductor die and said first surface of said semiconductor substrate including disposing at least one adhesive tape having a width of said at least one adhesive tape extending beyond said at least one opening edge of said semiconductor substrate a distance into said at least one opening of said semiconductor substrate to provide a surface detectable by a visual inspection system within said at least one opening of said semiconductor substrate;
- and
- aligning said at least one semiconductor die having said at least one electrical connection area oriented with said at least one semiconductor substrate opening having said at least one adhesive tape extending from at least an edge of said semiconductor die to at least an edge of said opening of said semiconductor substrate for filling an area located between an edge of said semiconductor die and an edge of said opening in said semiconductor substrate for substantially preventing filler particles in said encapsulant material from residing between the semiconductor die and the substrate from the encapsulation of the semiconductor die preventing damage to at least one of said active surface of said semiconductor die and said first surface of said semiconductor substrate.
A method of attaching a semiconductor die assembly having at least one substrate and at least one semiconductor die attached to said substrate for substantially preventing filler particles in said material from residing between the semiconductor die and the substrate from the encapsulation of the semiconductor die comprising:
- providing said at least one semiconductor substrate having a first surface and a having second surface, said semiconductor substrate including at least one opening defined through said semiconductor substrate between said semiconductor substrate first surface and said semiconductor substrate second surface, said at least one opening having a plurality of edges;
- providing said at least one semiconductor die having an active surface having at least one electrical connection area disposed on said semiconductor die active surface and having a plurality of edges;
- disposing at least one adhesive tape between said semiconductor die active surface and said semiconductor substrate first surface to attach said semiconductor die to said at least one semiconductor substrate, said at least one adhesive tape having a first layer of adhesive on a first side, having a second layer of adhesive on a second side, and having a width defined by a first edge extending from at least an edge of said plurality of edges of said at least one semiconductor die to a second edge extending to at least an edge of said plurality of edges of said at least one semiconductor substrate opening for substantially preventing filler particles in said encapsulant material from residing between the semiconductor die and the substrate from the encapsulation of the semiconductor die for preventing damage to at least one of said active surface of said semiconductor die and said first surface of said semiconductor substrate;
- and
- forming at least one fillet using a portion of one of the first adhesive layer and the second adhesive layer of said at least one adhesive tape at one of the first edge and the second edge of the width of said at least one adhesive tape.
Dependencies are inferred from the claim text.