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US 2002/0173081 A1Published application
Configuration and method for the contacting of circuits
AssigneeInfineon Technologies AG
InventorRudolf Lehner
Life of this patent
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Abstract
A configuration and method for contacting a circuit is described. A carrier is disposed adjacent a circuit, and a setting element at which an electrical connection formed of a conductive material is disposed, so that the electrical connection connects the circuit to the carrier in a bonding process. In this manner an efficient and cost effective method for connecting the circuit to carrier is performed.
Claims8
A method for contacting a circuit, which comprises the steps of:
- placing a conductive material into a mold to form at least one electrical connection adhering to a setting element;
- disposing a carrier adjacent to the circuit;
- and
- moving the setting element, to which the electrical connection formed of the conductive material adheres, next to the circuit and the carrier, so that the electrical connection conductively joins the circuit and the carrier.
1 more element
A configuration for contacting circuits, comprising:
- a circuit;
- a carrier disposed adjacent said circuit;
- a mold having a section being a setting element;
- and
- a conductive material disposed in said mold forming at least one preformed electrical connection joining said circuit to said carrier.
2 more elements
Dependencies are inferred from the claim text.