Microelectromechanical system device package and packaging method
AssigneeGeneral Electric Company
InventorsRichard Joseph Saia, Kevin Matthew Durocher, Christopher James Kapusta, Matthew Christian Nielsen
Life of this patent
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Abstract
A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.
Claims25
A method for packaging a microelectromechanical system (MEMS) device comprising:
- using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer;
- providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer;
- removing the release sheet;
- and
- attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.
6 The method of claim 1, wherein the adhesive comprises a mixture of photodielectric and epoxy materials.
A method for packaging a microelectromechanical system (MEMS) device comprising:
- coating an MEMS package flexible layer with an adhesive;
- partially curing the adhesive;
- using the adhesive to attach a release sheet to the MEMS package flexible layer;
- providing a cavity extending through the release sheet, the adhesive, and at least partially through the MEMS package flexible layer;
- removing the release sheet;
- using the adhesive to attach the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity;
- providing MEMS vias through the MEMS package flexible layer extending to connection pads of the MEMS device;
- and
- applying a MEMS pattern of electrical conductors on the MEMS package flexible layer and extending through the MEMS vias to the connection pads.
A package for a microelectromechanical system (MEMS) device comprising:
- an MEMS package flexible layer having a cavity extending at least partially therethrough;
- the MEMS device being attached to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.
Dependencies are inferred from the claim text.