A semiconductor device

A method of manufacturing a semiconductor device comprising:

• a first wire bonding step of using a supporting jig having a first supporting surface and a second supporting surface and a lead securing jig having a through hole, of making a second surface of an inner lead be in contact with the first supporting surface of the supporting jig and making a principle surface of a semiconductor chip be in contact with the second supporting surface of the supporting jig, of interposing, tightening, and fixing the inner lead by making the lead securing jig be in contact with the first surface of the inner lead, of bonding an end of a metallic wire to a pad of the semiconductor chip by means of ball bonding in an opening portion of the through hole, and of electrically connecting a standing linear portion of the ball bond to a tip end portion of the first surface of the inner lead by means of stitch bonding by pulling the standing linear portion in parallel with a thickness surface of a tip end portion of the inner lead;
• and
• a second wire bonding step of using a supporting jig having a first supporting surface and a second recessed surface and a lead securing jig having a through hole of dimensions larger than dimensions of the semiconductor chip, of making the first surface of the inner lead, processed in the first wire bonding step, be in contact with the first supporting surface of the supporting jig, of interposing, tightening, and fixing the inner lead by making a second surface of the inner lead be in contact with the lead securing jig, of bonding an end of a metallic wire to the second surface of the inner lead by means of ball bonding in an opening portion of the through hole, and of electrically connecting a standing linear portion of the ball bond to a pad of the semiconductor chip by means of stitch bonding by pulling the standing linear portion of the ball bond in parallel with a side surface of the semiconductor chip.

A method of manufacturing a semiconductor device comprising:

• a first wire bonding step of using a supporting jig having a first supporting surface, a second supporting surface, and an elastic material on the second supporting surface, and an lead securing jig having a through hole, of making a second surface of the inner lead be in contact with the first supporting surface of the supporting jig and making a principle surface of a semiconductor chip be in contact with the elastic material, of interposing, tightening, and fixing the first surface and the second surface of the inner lead by making the lead securing jig be in contact with the first surface of the inner lead, and of electrically connecting a pad of the semiconductor chip to a first surface of the inner lead in an opening portion of the through hole by means of forward wire bonding, and
• a second wire bonding step of using a supporting jig having a first supporting surface and a second recessed surface and an lead securing jig having a through hole of dimensions larger than dimensions of a semiconductor chip, of making the first surface of the inner lead, processed in the first wire bonding step, be in contact with the first supporting surface of the supporting jig, of interposing, tightening, and fixing the first surface and the second surface of the inner lead by making the lead securing jig be in contact with the second surface of the inner lead, and of electrically connecting the second surface of the inner lead to a pad of the semiconductor chip in an opening portion of the through hole by means of adverse wire bonding.