Method for underfilling bonding gap between flip-chip and circuit substrate
AssigneeWalsin Advanced Electronics LTD
InventorsSu Chun-Jen, Lai Chien-Hung, Lin Chien-Tsun, Chang Chao-Chia
Life of this patent
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Abstract
A method for underfilling bonding gap between flip-chip and circuit substrate is disclosed. A chip is mounted on a circuit substrate with flip-chip configuration. The circuit substrate has a top surface, a bottom surface, and a plurality of via holes. Some of the via holes are formed to be air vents passing through the top surface and the bottom surface. So that the underfill material flows into the gap between flip-chip and circuit substrate until jamming or blocking the said air vents rapidly while underfilling.
Claims12
A method for underfilling bonding gap between flip-chip and circuit substrate comprising the steps of:
- providing a circuit substrate having a top surface, a bottom surface and a plurality of via holes, wherein at least some of the via holes are air vents passing through the top surface and the bottom surface;
- mounting at least a chip with flip-chip configuration connecting to the top surface of the circuit substrate so that a gap is formed between the chip and the circuit substrate;
- and
- dispensing an underfill material on top surface of circuit substrate so that the underfill material flows to the gap between the chip and the circuit substrate and blocks said air vents.
A process for filling an underfill material of a flip-chip package comprises:
- providing a circuit substrate, having a top surface, a bottom surface and a plurality of via holes, wherein some of the via holes are air vents passing through the top surface and the bottom surface;
- providing a chip having a plurality of bumps on one surface of the chip;
- mounting the chip to the top surface of the circuit substrate in flip-chip form with bumps for electrically connecting the chip and the circuit substrate and forming gap between the chip and the circuit substrate;
- and
- dispensing an underfill material on the top surface of the circuit substrateso that the underfill material flows up the gap between the chip and the circuit substrate and blocks said air vents.
A flip-chip package comprising:
- a circuit substrate having a top surface, a bottom surface and a plurality via holes, wherein at least some of the via holes are air vents passing through the top surface and the bottom surface;
- a chip electrically connecting to the top surface of the circuit substrate with flip-chip configuration and forming a gap with the circuit substrate;
- and
- an underfill material filling up the gap and blocking said air vents.
Dependencies are inferred from the claim text.