Method for packaging an image sensor
OwnerHsiu-Wen Tu, Jichen Wuinventors
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Abstract
A packaging structure of an image sensor includes a plurality of metal sheets, a photosensitive chip, and transparent glue. Each of the metal sheets has a first surface and a second surface. The photosensitive chip is electrically connecting to the plurality of first surfaces of the metal sheets. The transparent glue is for covering the metal sheets and the photosensitive chip is capable of receiving optical signals. The second surfaces of the metal sheets bonded by the transparent glue are exposed to the outside so as to form signal output terminals for the image sensor. A method for packaging the structure is also disclosed.
Claims4
A method for packaging an image sensor, comprising the steps of:
- adhering a plurality of metal sheets onto a tape, the tape including a holding region for holding the photosensitive chip therein;
- placing the tape into a hollow mold;
- placing a photosensitive chip having a plurality of bonding pads onto the holding region of the photosensitive chip;
- electrically connecting the bonding pads of the photosensitive chip to the metal sheets using a plurality of wirings;
- pouring transparent glue into the mold to seal the metal sheets, the photosensitive chip, and the plurality of wirings so as to form a packaging structure;
- and
- taking out the image sensor from the mold and tearing off the tape with the metal sheets exposed to the outside through the transparent glue.
Dependencies are inferred from the claim text.