Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
OwnerKazutaka Shibatainventor
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Abstract
The present invention provides a mounting structure of a semiconductor chip (3) onto an insulated substrate (2). The insulated substrate (2) is made of a polyimide resin, at least side surfaces (3c) of the semiconductor chip (3) is protected by a protective resin (5) provided by a polyimide resin. The semiconductor chip (3) is held by the protective resin (5) with respect to the insulated substrate (2). Preferably, an adhesive layer (4) is provided between the semiconductor chip (3) and the insulated substrate (2). The adhesive layer (4) is also provided by a polyimide resin.
Claims21
A mounting structure of a semiconductor chip onto an insulated substrate,
- the insulated substrate being made of a polyimide resin,
- at least a side surface of the semiconductor chip being protected by a protective resin provided by a polyimide resin, the semiconductor chip being held by the protective resin with respect to the insulated substrate.
A semiconductor device comprising:
- an insulated substrate;
- and
- a semiconductor chip mounted on the insulated substrate;
- wherein the insulated substrate is made of a polyimide resin, and
- wherein at least a side surface of the semiconductor chip is protected by a protective resin provided by a polyimide resin, the semiconductor chip being held by the protective resin with respect to the insulated substrate.
A method of manufacturing a semiconductor device, comprising steps of:
- mounting a semiconductor chip on an insulated substrate;
- and
- covering at least a side surface of the semiconductor chip with a protective resin, thereby holding the semiconductor chip with respect to the insulated substrate;
- characterized that the protective resin is formed by thermal imidization of a liquid polyamide precursor.
The method according to claim 21, wherein
- ultrasonic wave is applied to the semiconductor chip when pressing the semiconductor chip onto the insulated substrate under heat via the adhesive layer.
Dependencies are inferred from the claim text.