Method for forming a compact sensing apparatus in a dual-piece monolithic substrate

A method for forming a compact sensing apparatus, the method comprising:

• forming a sensor and a signal conditioner on a single monolithic semiconductor, the monolithic substrate formed from a semiconductor wafer and having first and second opposing wafer surfaces;
• orienting the sensor and the signal conditioner so that the sensor and the signal conditioner are positioned with respect to each other at a predetermined angle greater than one hundred eighty (180) degrees, the predetermined angle being defined by the angle of rotation between an imaginary initial plane extending substantially parallel to the signal conditioner and an imaginary terminal place extending substantially parallel to the sensor;
• and
• forming an electrically conductive path between the sensor and the signal conditioner.

A method for forming a compact sensing apparatus, the method comprising:

• forming a sensor and a signal conditioner on a single monolithic semiconductor substrate;
• separating the semiconductor substrate into a sensor substrate the sensor formed thereon and a signal conditioner substrate having the signal conditioner formed thereon;
• fixedly positioning the sensor substrate and the signal conditioner substrate relative to each other so that the sensor and the signal conditioner are oriented with respect to each other at a predetermined angle greater than one hundred eighty (180) degrees, the predetermined angle being defined by the angle of rotation between an imaginary initial plane extending substantially parallel to the signal conditioner and an imaginary terminal place extending substantially parallel to the sensor;
• and
• forming an electrically conductive path between the sensor and the signal conditioner.

A method for forming a compact sensing apparatus, the method comprising:

• forming a sensor and a signal conditioner on a single monolithic semiconductor substrate;
• separating the semiconductor substrate into a sensor substrate the sensor formed thereon and a signal conditioner substrate having the signal conditioner formed thereon;
• flexibly positioning the sensor substrate and the signal conditioner substrate relative to each other so that the sensor and the signal conditioner are oriented with respect to each other at a predetermined angle greater than one hundred eighty (180) degrees, the predetermined angle being defined by the angle of rotation between an imaginary initial plane extending substantially parallel to the signal conditioner and an imaginary terminal place extending substantially parallel to the sensor;
• and
• forming an electrically conductive path between the sensor and the signal conditioner.

A method for forming a compact sensing apparatus, the method comprising:

• forming a sensor and a signal conditioner on a monolithic semiconductor substrate;
• separating the semiconductor substrate into a sensor substrate on which the sensor is formed and a signal conditioner substrate on which the signal conditioner is formed;
• positioning the sensor substrate and the signal conditioner substrate on a flexible conducting cable;
• bending the flexible conducting cable so that the sensor and the signal conditioner are oriented with respect to each other at a predetermined angle greater than one hundred eighty (180) degrees, the predetermined angle being defined by the angle of rotation between an imaginary initial plane extending substantially parallel to the signal conditioner and an imaginary terminal place extending substantially parallel to the sensor;
• and
• forming an electrically conductive path positioned between the sensor and the signal conditioner, the path being connected to the sensor and the signal conditioner to electrically connect the sensor and the signal conditioner.