Back to results
US 2002/0172916 A1Published application
Curing light
AssigneeCAO Group, Inc.
InventorDensen Cao
Life of this patent
Estimating the term…
Abstract
A curing light system useful for curing light activated composite materials is disclosed. Various configurations of light emitting semiconductor chips and heat sinks are disclosed, as well as various structures and methods for driving, controlling and using them.
Claims17
A curing light comprising:
- a housing for housing components of a curing light,
- a heat sink located within said housing,
- at least one semiconductor chip which can emit light of a wavelength useful for curing light curable composite materials,
- said heat sink serving to dissipate heat produced by said chip, and
- a light reflective device which collects light emitted by said chip and reflects it as a light beam.
2 more elements
A curing light comprising:
- a heat sink useful for dissipating heat,
- at least one semiconductor chip which can emit light of a wavelength useful for curing light curable composite materials,
- said heat sink serving to dissipate heat produced by said chip, and
- a focusing lens which serves to focus light emitted by said chip into a light beam.
1 more element
A curing light comprising:
- a heat sink located within said housing,
- a thermoelectric cooler to assist in heat dissipation located on heat sink,
- a fan located within said housing, said fan being capable of causing air to move past said thermoelectric cooler in order to improve heat dissipation,
- at least one semiconductor chip,
- said chip being capable of emitting light useful for curing composite materials,
- said heat sink and said thermoelectric cooler serving to dissipate heat created by said chip,
- a light reflective device which collects light emitted by said chip and reflects it as a light beam,
4 more elements
A curing light comprising:
- a heat sink located within said housing,
- a thermoelectric cooler to assist in heat dissipation located on heat sink,
- a fan located within said housing, said fan being capable of causing air to move past said thermoelectric cooler in order to improve heat dissipation,
- at least one semiconductor chip,
- said chip being capable of emitting light useful for curing composite materials,
- said heat sink and said thermoelectric cooler serving to dissipate heat created by said chip,
3 more elements
A curing light comprising:
- a heat sink,
- a semiconductor chip which can emit light of a wavelength useful for curing light curable composite materials,
- said heat sink serving to draw heat away from said chip,
- a light reflective device which collects light emitted by said chip and reflects it as a light beam,
- a focusing lens which serves to focus said light beam from said light reflective device.
2 more elements
A curing light comprising:
- a heat sink,
- a thermoelectric cooler located on said heat sink,
- a semiconductor chip capable of emitting light that is useful in curing composite materials,
- said heat sink and thermoelectric cooler serving to draw heat away from said chip and dissipate it,
- a light reflective device which collects light emitted by said chip and reflects it as a light beam, and
- a focusing lens which serves to focus said light beam from said light reflective device.
3 more elements
Dependencies are inferred from the claim text.