Method of joining two or more substrates with a seam
AssigneeClemson University
InventorsChristine W. Jarvis, Robert E. Bennett, Brian Frederick
Life of this patent
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Abstract
A method for joining two or more substrates with a seam is provided. The seam is formed with a thermoplastic tape that is capable of forming an adhesive bond and a physical bond with a substrate. For instance, in one embodiment, the thermoplastic tape is formed from a polyurethane film. In addition, the seam can be utilized in a flat configuration or folded into a variety of different shapes, such as in a z-shaped configuration. As a result of the present invention, it has been discovered that a seam can be formed to have improved strength without substantially sacrificing the desired functional properties of the substrate materials.
Claims40
A method of forming a seam between substrates comprising:
- providing a first substrate having an upper surface and a lower surface, said upper and said lower surfaces of said first substrate defining at least one edge;
- providing a second substrate having an upper surface and a lower surface, said upper and said lower surfaces of said second substrate defining at least one edge;
- overlapping said edge of said first substrate with said edge of said second substrate;
- positioning a first tape portion adjacent to said first substrate such that said first tape portion is placed in operative communication with said upper and said lower surfaces of said first substrate, said first tape portion comprising a thermoplastic material that is melt-flowable when subjected to a certain amount of heat and pressure;
- positioning a second tape portion adjacent to said second substrate such that said second tape portion is placed in operative communication with said upper and lower surfaces of said second substrate, said second tape portion comprising a thermoplastic material that is melt-flowable when subjected to a certain amount of heat and pressure;
- forming an adhesive bond and a physical bond between said first tape portion and said first substrate and between said second tape portion said second substrate.
A method of forming a seam between substrates comprising:
- providing a first substrate having an upper surface and a lower surface, said upper and said lower surfaces of said first substrate defining at least one edge;
- providing a second substrate having an upper surface and a lower surface, said upper and said lower surfaces of said second substrate defining at least one edge;
- overlapping said edge of said first substrate with said edge of said second substrate;
- positioning a first tape portion adjacent to said first substrate such that said first tape portion is placed in operative communication with said upper and said lower surfaces of said first substrate, said first tape portion comprising a thermoplastic material that is melt-flowable when subjected to a certain amount of heat and pressure;
- positioning a second tape portion adjacent to said second substrate such that said second tape portion is placed in operative communication with said upper and lower surfaces of said second substrate, said second tape portion comprising a thermoplastic material that is melt-flowable when subjected to a certain amount of heat and pressure;
- folding said tape into a z-shaped configuration;
- subjecting said first tape portion to simultaneous heat and pressure;
- subjecting said second tape portion to simultaneous heat and pressure;
- and
- forming an adhesive bond and a physical bond between said first tape portion and said first substrate and between said second tape portion said second substrate.
A seam for joining two or more substrates of an article, said seam comprising:
- a first substrate having an upper surface and a lower surface, said upper and said lower surfaces of said first substrate defining at least one edge;
- a second substrate having an upper surface and a lower surface, said upper and said lower surfaces of said second substrate defining at least one edge, said edge of said second substrate overlapping said edge of said first substrate;
- a first tape portion comprising a thermoplastic material that is melt-flowable when subjected to a certain amount of heat and pressure, said first tape portion being adhesively and physically bonded to said upper and said lower surfaces of said first substrate;
- a second tape portion comprising a thermoplastic material that is melt-flowable when subjected to a certain amount of heat and pressure, said second tape portion being adhesively and physically bonded to said upper and said lower surfaces of said second substrate.
Dependencies are inferred from the claim text.