Low-stress innerl structure for optoelectronic housing
AssigneeAvanex Corporation
InventorsSylvaine Kerboeuf, Emmanuel Grard, Claude Artigue, Pierre Jean Laroulandie, Alwin Goeth, Klaus Adam
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AssigneeAvanex Corporation
InventorsSylvaine Kerboeuf, Emmanuel Grard, Claude Artigue, Pierre Jean Laroulandie, Alwin Goeth, Klaus Adam
Estimating the term…
In an optoelectronic module (1) comprising a plastics material package (2) accommodating a base (8) fixed to the package (2) and supporting an optical component (9) coupled by an optical fiber (5) to an optical connector (4) of the package (2), fiber displacements associated with thermal stresses are avoided by mounting the base so that it floats on the package (2) and possibly the connector (4). The floating mounting of the base (8) is obtained by using for fixing the base one or more adhesives (13, 14) having a greater elasticity than the adhesives used to fix each of the two ends (6, 7) of the fiber (5) to the base (8) and the connector (4), respectively.
An optical module (1) including a package (2) having a bottom (3) and accommodating:
Dependencies are inferred from the claim text.