Pressure responsive device and method of manufacturing semiconductor substrate for use in pressure responsive device

A method of manufacturing a semiconductor substrate used in a pressure responsive device, the semiconductor substrate having a concave with a bottom surface, a peripheral surface surrounding the concave, and at least one communication groove running from an inner circumference to an outer circumference of the peripheral surface on one main surface,

• the method comprising:
• a first step of forming a first resist membrane on the entire one main surface of the semiconductor substrate;
• a second step of patterning the first resist membrane so as to form an opening while leaving the first resist membrane on the peripheral surface, the opening is positioned on an inner portion of the peripheral surface;
• a third step of forming a concave of 5 to 15 μm in depth through the opening using the first resist membrane as a mask;
• a fourth step of removing the first resist;
• a fifth step of forming a second resist membrane so as to cover the concave and the peripheral surface;
• a sixth step of patterning the second resist membrane so as to expose at least one passage running from the inner circumference to the outer circumference of the peripheral surface;
• and
• a seventh step of forming a communication groove of 2 to 3.5 μm in depth on the passage using the second resist membrane as a mask.