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US 2002/0172255 A1Published application
Microstructured thermosensor
AssigneeRobert Bosch GmbH
InventorsThorsten Pannek, Hans-Peter Trah
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AssigneeRobert Bosch GmbH
InventorsThorsten Pannek, Hans-Peter Trah
Estimating the term…
A micropatterned thermosensor (5), in particular an infrared sensor, is proposed, having a supporting body (12) and at least one thermocouple (20) arranged thereon. The thermocouple (20) also has a first material (13) and a second material (14), which together form, at least in a pointwise manner, at least one thermal contact (10, 11). Furthermore, it is provided that the first and/or the second material (13, 14) are configured at least regionally in the form of a meander-shaped or undulating-type circuit trace (15, 16) and run on the supporting body (12). In addition, a micropatterned thermosensor (5) is proposed, preferably also having such patterned circuit traces (15, 16), in which the first material (13) is platinum or aluminum, and the second material (14) is doped or undoped polysilicon-germanium.
A micropatterned thermosensor, in particular an infrared sensor, including a supporting body and at least one thermocouple located thereon, which has a first material and a second material which form at least in a point-wise manner, at least one thermal contact with each other, wherein the first and/or the second material (13, 14) are at least regionally designed in the form of a meander-shaped or undulating-type circuit trace (15, 16) and run on the supporting body (12).
The micropatterned thermosensor as recited in at least one of the preceding claims, wherein the first and/or the second material (13, 14) is a material having low thermal conductivity.
The micropatterned thermosensor as recited in at least one of the preceding claims, wherein the first and the second material (13, 14) are selected from the platinum, gold, lead tellurides, aluminum, titanium, polysilicon, doped polysilicon, polysilicon-germanium or doped polysilicon-germanium group.
The micropatterned thermosensor, in particular the infrared sensor, including a supporting body and at least one thermocouple located thereon, having a first material and a second material, which form at least in a point-wise manner at least one thermal contact with each other, wherein the second material (14) is platinum or aluminum and the first material (13) is doped or undoped polysilicon-germanium.
Dependencies are inferred from the claim text.