Optical pickup and method of fixing a plate with an electronic component
AssigneeFunai Electric Co., Ltd.
InventorsKenichi Fujita, Suehiro Harada
Life of this patent
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Abstract
A plate 2 with a photodiode PD is positioned with a slight interval with respect to a housing 1, a small amount of an ultraviolet curing adhesive 8a is applied to four portions each located between a corner of either side edge 2a of the plate 2 and the housing 1, the ultraviolet curing adhesive 8a is allowed to cure by application of ultraviolet rays thereto to temporarily fix the plate 2 to the housing 1, an appropriate amount of a thermosetting adhesive is applied to two portions each located between a central portion of either side edge 2a of the plate 2 and the housing 1, and the thermosetting adhesive 8b is allowed to cure by heating so as to finally fix the plate 2 to the housing 1.
Claims5
An optical pickup, comprising
- a plate with a photodiode positioned with a slight interval with respect to a housing,
- a small amount of an ultraviolet curing adhesive applied between either side edge of said plate and said housing,
- the ultraviolet curing adhesive allowed to cure by application of ultraviolet rays thereto to temporarily fix said plate to said housing,
- an appropriate amount of a thermosetting adhesive applied between a central portion of said either side edge of said plate and said housing, and
- the thermosetting adhesive allowed to cure by heating so as to finally fix said plate to said housing.
An optical pickup, comprising:
- a plate with a electronic component positioned with a slight interval with respect to a housing,
- a small amount of an ultraviolet curing adhesive applied between said plate and said housing,
- the ultraviolet curing adhesive allowed to cure by application of ultraviolet rays thereto to temporarily fix said plate to said housing,
- an appropriate amount of a thermosetting adhesive applied between said plate and said housing, and
- the thermosetting adhesive allowed to cure by heating so as to finally fix said plate to said housing.
A method of fixing a plate with an electronic component in an optical pickup, comprising the steps of:
- positioning a plate with an electric component at a predetermined interval from a housing as a positioning arm retaining said plate is moved in three-dimensional directions including back-and-forth, left-and-right, and vertical directions;
- applying a small amount of an ultraviolet curing adhesive between either side edge of said plate and said housing;
- allowing the ultraviolet curing adhesive to cure by application of ultraviolet rays thereto to temporarily fix said plate to said housing;
- moving said positioning arm from said plate;
- applying an appropriate amount of a thermosetting adhesive to gaps other than portions where the ultraviolet curing adhesive has been applied between said either side edge of said plate and said housing;
- and
- allowing the thermosetting adhesive to cure by heating so as to finally fix said plate to said housing.
Dependencies are inferred from the claim text.