Electronic package with high density interconnect and associated methods

An electronic package comprising:

• an integrated circuit (IC) comprising a first plurality of lands on a surface thereof, including a first dense formation of lands;
• a substrate comprising a second plurality of lands on a surface thereof, including a second dense formation of lands formed in a geometrical pattern to maximize the density of the second dense formation of lands, while constrained by the size of the second dense formation of lands and by the width and spacing of substrate traces coupled to the second dense formation of lands;
• and
• elements coupling the first plurality of lands to the second plurality of lands.

An electronic system comprising least one electronic package comprising:

• an integrated circuit (IC) comprising a first plurality of lands on a surface thereof, including a first dense formation of lands;
• a substrate comprising a second plurality of lands on a surface thereof, including a second dense formation of lands formed in a geometrical pattern to maximize the density of the second dense formation of lands, while constrained by the size of the second dense formation of lands and by the width and spacing of substrate traces coupled to the lands;
• and
• elements coupling the first plurality of lands to the second plurality of lands.

A data processing system comprising:

• a bus coupling components in the data processing system;
• a display coupled to the bus;
• external memory coupled to the bus;
• and
• a processor coupled to the bus and including at least one electronic package comprising:
• an integrated circuit (IC) comprising a first plurality of lands on a surface thereof, including a first dense formation of lands;
• a substrate comprising a second plurality of lands on a surface thereof, including a second dense formation of lands formed in a geometrical pattern to maximize the density of the second dense formation of lands, while constrained by the size of the second dense formation of lands and by the width and spacing of substrate traces coupled to the lands;
• and
• elements coupling the first plurality of lands to the second plurality of lands.

A method of forming a substrate comprising a plurality of layers, the method comprising:

• for a first layer, forming a first plurality of traces having at least a predetermined width and a predetermined spacing from one another;
• for a second layer, forming a second plurality of traces having at least a predetermined width and a predetermined spacing from one another;
• for the first and second layers, forming a plurality of vias to couple ones of the first plurality of traces to ones of the second plurality of traces;
• and
• for the second layer, forming a first plurality of lands each coupled to a corresponding one of the plurality of traces of the second layer, and each having at least a predetermined size, the first plurality of lands being formed in a geometrical pattern that maximizes the density of the first plurality of lands while constrained by the land size and by the width and spacing of the traces of the second layer.