Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged

A semiconductor device assembly, comprising:

• a semiconductor die with at least one bond pad on an active surface thereof;
• a tape secured to said active surface, said tape including a slot formed therethrough with said at least one bond pad being exposed through said slot, at least one end of said slot extending beyond an outer periphery of said semiconductor die;
• and
• a substrate element positioned over said semiconductor die opposite said tape from said semiconductor die, said substrate element including at least one opening formed therethrough through which said at least one bond pad is exposed.

A method for packaging at least an active surface of a semiconductor die, comprising:

• positioning a tape over the active surface so that at least one bond pad on the active surface is exposed through a slot formed through said tape and at least one end of said slot extends beyond an outer periphery of the semiconductor die;
• positioning a substrate element over said tape so that said at least one bond pad is exposed through at least one opening formed through said substrate element and aligned with said slot, said substrate element including at least one conductive area corresponding to said at least one bond pad;
• electrically connecting said at least one bond pad to said at least one conductive area;
• positioning a coverlay on an exposed surface of said substrate element to substantially cover said at least one opening formed through said substrate element;
• and
• introducing encapsulant material through said at least one end into a receptacle formed by said coverlay, said at least one opening, said slot, and said semiconductor die from a location opposite the semiconductor die from said tape.

A method for preparing a semiconductor die for packaging, comprising:

• positioning a tape over at least an active surface of the semiconductor die, said tape including a slot through which at least one bond pad on the active surface of the semiconductor die is exposed, at least a portion of said slot extending laterally beyond an outer periphery of the semiconductor die;
• positioning a substrate element over said tape with at least one opening formed through said substrate element being located at least partially over said slot;
• and
• positioning a coverlay over said substrate element to substantially seal said at least one opening, said coverlay and lateral edges of said at least one opening and said slot forming a receptacle.