Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
AssigneeINCEP Technologies, Inc.
InventorsJoseph Ted DiBene II, David H. Hartke
Life of this patent
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Abstract
A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
Claims20
A modular circuit board assembly, comprising:
- a substrate, having one or more components mounted thereon;
- a circuit board, including a power circuit supplying power to the one or more components;
- at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device for physically separably and electrically coupling the circuit board to the substrate;
- wherein the substrate is communicatively coupled to a plurality of signal conductors disposed on a side of the substrate opposite the circuit board;
- and
- wherein substantially all power supplied to the substrate is provided by the at least one conductive interconnect device.
Dependencies are inferred from the claim text.