Suspension, head gimbal assembly and manufacturing method of head gimbal assembly
AssigneesTDK Corporation, SAE Magnetics (H.K.) Ltd.
InventorsTakeshi Wada, Norikazu Ota, Takashi Honda, Masashi Shiraishi
Life of this patent
Estimating the term…
Loading patent…
AssigneesTDK Corporation, SAE Magnetics (H.K.) Ltd.
InventorsTakeshi Wada, Norikazu Ota, Takashi Honda, Masashi Shiraishi
Estimating the term…
An HGA includes a magnetic head slider with at least one thin-film magnetic head element, a resilient flexure made of a stainless steel, supporting the magnetic head slider, a load beam made of a stainless steel, supporting the flexure, for applying a predetermined load to the magnetic head slider, a drive IC chip with a circuit for the at least one thin-film magnetic head element, a lead conductor member on which the drive IC chip is mounted, and a high-thermal-conductivity member made of a material with a higher thermal conductivity than that of the stainless steel and inserted between the lead conductor member and the load beam in a region containing at least a section on which the drive IC chip is mounted.
A suspension comprising:
A head gimbal assembly comprising:
A method of manufacturing a head gimbal assembly, comprising the steps of:
A method of manufacturing a head gimbal assembly, comprising the steps of:
Dependencies are inferred from the claim text.