Data input device using a laminated substrate capable of reliably filling through holes with electroconductive material

Abstract

A laminated substrate includes a first substrate having electrodes and through-holes formed thereon, a second substrate having wiring patterns formed thereon and laminated under the first substrate through an insulating layer, an electroconductive material filled in the through-holes so that the electrodes of the first substrate are electrically conducted to the wiring patterns of the second substrate therethrough, and air vent passages having longitudinal paths passing through the first substrate and communicating with the outside from the front surface of the first substrate and lateral paths located between the first substrate and the second substrate for communicating the longitudinal paths with the through-holes. With this arrangement, when both the substrates are electrically conducted to each other, the electrodes of the first substrate are electrically conducted to the wiring patterns of the second substrate reliably through the conductive material which is filled in the through-holes securely.

Dependencies are inferred from the claim text.