Integrated circuit device, electronic equipment, and method of placement of an integrated circuit device
AssigneeSeiko Epson Corporation
InventorsShoichiro Kasahara, Chisato Akiyama, Fumikazu Komatsu
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AssigneeSeiko Epson Corporation
InventorsShoichiro Kasahara, Chisato Akiyama, Fumikazu Komatsu
Estimating the term…
A macrocell MC1 including a physical-layer circuit in accordance with USB 2.0 or the like is placed at a corner of an integrated circuit device ICD. Data terminals DP and DM are placed in an I/O region IOR1 along a side SD1; and power terminals PVDD, PVSS, XVDD, and XVSS and clock terminals XI and XO of a clock generation circuit and a sampling clock circuit are placed in an I/O region IOR2 along a side SD2. An interface region and a macrocell MC2 including user-specified logic are provided along a side SD3. A reception circuit is placed on a DR1 side of IOR1, a clock generation circuit is placed on a DR2 side of IOR2, and a sampling clock generation circuit is placed on the DR1 side of the reception circuit and also the DR2 side of the clock generation circuit. A transmission circuit is placed on the DR2 side of the reception circuit and on the DR1 side of the data terminals DP and DM.
An integrated circuit device including a plurality of macrocells, the integrated circuit device comprising:
A method of placing an integrated circuit device that includes a first macrocell which includes at least a physical-layer circuit conforming to a given interface standard for performing data transfer through a bus;
A method of placing an integrated circuit device that includes a first macrocell which includes at least a physical-layer circuit conforming to a given interface standard for performing data transfer through a bus;
A method of placing an integrated circuit device that includes a first macrocell which includes at least a physical-layer circuit conforming to a given interface standard for performing data transfer through a bus;
A method of placing an integrated circuit device that includes a first macrocell which includes at least a physical-layer circuit conforming to a given interface standard for performing data transfer through a bus;
A method of placing an integrated circuit device that includes a first macrocell which includes at least a physical-layer circuit conforming to a given interface standard for performing data transfer through a bus;
A method of placing an integrated circuit device that includes a first macrocell which includes at least a physical-layer circuit conforming to a given interface standard for performing data transfer through a bus;
Dependencies are inferred from the claim text.