Process for producing resonant tag
AssigneeKabushiki Kaisha Miyake
InventorsSHINYA UCHIBORI, TAKAAKI MIZUKAWA, YOSHINORI HATANAKA
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AssigneeKabushiki Kaisha Miyake
InventorsSHINYA UCHIBORI, TAKAAKI MIZUKAWA, YOSHINORI HATANAKA
Estimating the term…
A process for producing a resonant tag, wherein a metal foil having a thermal adhesion adhesive applied to at least one face thereof is stamped out into a circuit-like shape and is adhered to a base sheet, the process comprising: stamping out the metal foil into a predetermined shaped metal foil portion (4c) while being passed through a die roll (1) having thereon a stamping blade with a predetermined shape and a transfer roll (2) in contact with the die roll (1) which functions also as a die back-up roll; holding this metal foil portion obtained by the stamping-out operation onto the surface of the transfer roll by suction holes formed in the transfer roll; and thermally adhering the stamped metal foil portion to the base sheet (7) in contact with the transfer roll (2) at its another face by an adhesive roll (3) in contact with the transfer roll through the base sheet. The present invention has such advantages as no damage to the base sheet since the stamping-out operation for the metal foil and the thermal adhesion operation thereof to the base sheet are carried out in separate positions, and no requirement of carrier sheet because the resultant metal foil portion obtained by the stamping-out operation is sucked and held onto the surface of the transfer roll.
A process for producing a resonant tag, wherein a metal foil having a thermal adhesion adhesive applied to at least one face thereof is stamped out into a circuit-like shape and is adhered to a base sheet,
A process for producing a resonant tag, wherein a metal foil having a thermal adhesion adhesive applied to at least one face thereof is stamped out into a circuit-like shape and is adhered to a base sheet,
An apparatus for producing a resonant tag comprising:
An apparatus for producing a resonant tag comprising:
A resonant circuit characterized in that at least two circuit-like coils in which the line-width of each circuit is {fraction (1/50)} or more to the length of the most outer periphery of each circuit and the number of winding the coil is made round three times or less are provided on the both faces of a dielectric film in such a manner that the both circuit-like coils are faced to each other.
Dependencies are inferred from the claim text.