Application and test methodology for use with compression land grid array connectors
AssigneeInternational Business Machines Corporation
InventorsWiren D. Becker, Michael F. McAllister, Gerhard Ruehle
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Abstract
A counterbalancing arrangement for use with a compressive land grid array connector system provides a counterbalancing load element at a side of a system circuit board opposite a back side holding an integrated circuit chip substrate via the connector system. In a first aspect, the counterbalancing load element is a probe template and spacer element providing measurement across to the integrated circuiting. In another aspect, the counterbalancing load element is a mirror image integrated circuit land grid array connector system.
Claims13
A test probing arrangement for use with a compressive land grid array connector system wherein an integrated circuit chip substrate is compressively sandwiched between a cooling element and a system circuit board at one side of the board, the arrangement comprising:
- a space transformer element for relocating inputs and outputs of a first grid spacing into a second grid spacing, the transformer element positioned at a side of the system circuit board opposite that holding the integrated circuit chip substrate;
- a retaining element for holding the space transformer element against the system circuit board;
- and
- a probe template overlying the retaining element for receipt of a probe at a plurality of positions on the template for accessing the integrated circuit chip via the space transformer element.
A test probing arrangement for use with a compressive land grid array connector system wherein an integrated circuit chip substrate is compressively sandwiched between a cooling element and a system circuit board at one side of the board, the arrangement comprising:
- a spacer element positioned at a side of the system board opposite that holding the integrated circuit chip substrate;
- a probe template overlying the spacer element for receipt of a probe at a plurality of positions on the template for accessing the integrated circuit chips via the spacer element;
- and
- a retaining device for coupling the probe template and spacer element to the system board.
A counterbalancing arrangement for use with a compressive land grid array connector system wherein a first integrated circuit chip substrate is compressively sandwiched between a first cooling element and a system circuit board at one side of the board, the arrangement comprising:
- a counterbalancing load element coupled to the system circuit board at a side of the board opposite that holding the integrated circuit chip substrate.
Dependencies are inferred from the claim text.