Semiconductor device and method for manufacturing the same
AssigneeSumitomo Electric Industries, Ltd.
InventorMitsuaki Fujihira
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a lower conductive member, a upper conductive member and a conductive wire. The one end of the conductive wire is electrically connected to a semiconductor chip. The lower conductive member is formed on a lead frame. The conductive wire is sandwiched between the lower conductive member and the upper conductive member located thereon and is electrically connected to the lead frame. A connecting portion of the conductive wire connected to the lead frame is sandwiched between the lower and upper conductive members so that the neck portion of the conductive wire can be protected from above.
Claims14
A semiconductor device comprising:
- a lower conductive member formed on a wiring member to be electrically connected to a semiconductor chip;
- a conductive wire having the one end electrically connected to said semiconductor chip and the other end electrically connected to said lower conductive member;
- and
- a upper conductive member formed on said lower conductive member so as to sandwich the other end of said conductive wire.
A semiconductor device comprising:
- a first connecting member having a lower conductive member formed on a wiring member to be electrically connected to a semiconductor chip and a connecting portion connected to said wiring member at a different position from said lower conductive member;
- a upper conductive member formed on said lower conductive member;
- and
- a conductive wire having the one end electrically connected to said semiconductor chip and the other end sandwiched said lower and upper conductive members and electrically connected to said lower conductive member.
A semiconductor device comprising:
- a first connecting member having a lower conductive member formed on a wiring member to be electrically connected to a semiconductor chip and a connecting portion connected to the wiring member at a different position from said lower conductive member;
- a second connecting member having an upper conductive member formed on said lower conductive member and a connecting portion connected to said wiring member at a different position from said lower conductive member;
- and
- a conductive wire having the one end electrically connected to said semiconductor chip and the other end sandwiched between said lower conductive member and said upper conductive member and electrically connected to said lower conductive member.
A method for manufacturing a semiconductor device in which a semiconductor chip and a wiring member are electrically connected to each other, comprising:
- a first step of forming a lower conductive member on said wiring member;
- a second step of connecting the one end of a conductive wire to said semiconductor chip;
- a third step of connecting said conductive wire to said lower conductive member;
- and
- a fourth step of forming an upper conductive member on said lower conductive member through said conductive wire.
Dependencies are inferred from the claim text.