Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
AssigneeSeiko Epson Corporation
InventorNobuaki Hashimoto
Life of this patent
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Abstract
A method of manufacturing a semiconductor device comprises: a first step of interposing a thermosetting anisotropic conductive material 16 between a substrate 12 and a semiconductor chip 20; a second step in which pressure and heat are applied between the semiconductor chip 20 and the substrate 12, an interconnect pattern 10 and electrodes 22 are electrically connected, and the anisotropic conductive material 16 is spreading out beyond the semiconductor chip 20 and is cured in the region of contact with the semiconductor chip 20; and a third step in which the region of the anisotropic conductive material 16 other than the region of contact with the semiconductor chip 20 is heated.
Claims36
A method of manufacturing a semiconductor device comprising:
- a first step of interposing an adhesive between a surface of a substrate on which an interconnect pattern is formed and a surface of a semiconductor chip on which electrodes are formed;
- a second step of applying energy between said semiconductor chip and said substrate, electrically connecting said interconnect pattern and said electrodes, and making adhesive properties of said adhesive effective in the region of contact with said semiconductor chip while said adhesive spreading out beyond said semiconductor chip;
- and
- a third step of applying energy to the region of said adhesive other than the region of contact with said semiconductor chip.
A method of manufacturing a semiconductor device, comprising:
- a first step of interposing an adhesive between a surface of a substrate on which an interconnect pattern is formed and a surface of a semiconductor chip on which electrodes are formed;
- a second step of electrically connecting said interconnect pattern and said electrodes, and curing said adhesive at least in a position between said semiconductor chip and said substrate while said adhesive spreading out beyond said semiconductor chip;
- and
- a third step of cutting said substrate in a region in which said adhesive spreads out beyond said semiconductor chip.
A semiconductor device, comprising:
- a semiconductor chip having electrodes;
- a substrate having an interconnect pattern;
- and a thermosetting adhesive;
- wherein said electrodes and said interconnect pattern are electrically connected;
- and
- wherein said adhesive is interposed between a surface of said substrate on which said interconnect pattern is formed and a surface of said semiconductor chip on which said electrodes are formed, and spreads out beyond said semiconductor chip, and the whole of said adhesive is cured.
Dependencies are inferred from the claim text.