Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding

A semiconductor device comprising:

• a semiconductor bare chip mounted on a circuit board by flip-chip bonding, the semiconductor bare chip having a power supply terminal and a grounding terminal on a back surface thereof;
• and
• a board member including a board and a thin-film structure capacitor formed on a surface of the board, the thin-film structure capacitor having terminals, on a surface of the capacitor, which correspond to the power supply terminal and the grounding terminal of the semiconductor bare chip,
• wherein the board member is arranged so that the terminals of the thin-film structure capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip, and the thin-film structure capacitor is bonded to the back surface of the semiconductor bare chip.

A board member which is bonded to a back surface of a semiconductor bare chip, the semiconductor bare chip mounted on a circuit board by flip-chip bonding, the semiconductor bare chip having a power supply terminal and a grounding terminal on the back surface thereof, the board member comprising:

• a board;
• and
• a thin-film structure capacitor formed on a surface of the board, the thin-film structure capacitor having terminals, on a surface of the capacitor, which correspond to the power supply terminal and the grounding terminal of the semiconductor bare chip,
• wherein the board member is arranged so that the terminals of the thin-film structure capacitor are electrically connected to the power supply terminal and the grounding terminal of the semiconductor bare chip.