BGA type semiconductor device, tape carrier for semiconductor device, and semiconductor device using said tape carrier
AssigneeHitachi Cable, Ltd.
InventorsAkifumi Higuchi, Toyoharu Koizumi, Norihiro Ashizuka
Life of this patent
Estimating the term…
Abstract
In a BGA type semiconductor device wherein, while leaving a via hole for a solder ball, an insulating film formed of a photosolder resist (PSR) is provided on a tape substrate on its side where a wiring pattern is provided, a groove portion is provided between a bonding wire sealing portion and the via hole for a solder ball. The groove portion is a smaller-thickness portion of the insulating film provided as a part of the insulating film. By virtue of this construction, at the time of sealing of a wire bonding connection with a mold resin, the flow of the mold resin into the via hole for a solder ball can be prevented.
Claims13
A BGA type semiconductor device comprising
- a BGA type interposer comprising:
- a tape substrate formed of a resin insulating film;
- a wiring pattern, formed of a metal foil, provided on one side of the tape substrate;
- a bonding pad, for connection to a semiconductor, provided on one end of the wiring pattern;
- a solder ball mounting pad provided on the other end of the wiring pattern or in a portion between both ends of the wiring pattern;
- an insulating film provided on the surface of the wiring pattern in the region of the solder ball mounting pad while leaving a via hole for a solder ball;
- a window hole for wire bonding of the bonding pad to an electrode in a semiconductor element;
- and a groove portion which is a smaller-thickness portion of the insulating film provided in a part of the insulating film, for preventing the flow of a mold resin into the via hole for a solder ball,
- a semiconductor element, provided with an electrode, mounted on the tape substrate, in the interposer, on its side remote from the wiring pattern, said electrode in the semiconductor element having been wire bonded to the bonding pad through the window hole, the connection between the bonding pad and the semiconductor element having been sealed with a mold resin by pouring the mold resin into the window hole while preventing the flow of the mold resin into the via hole for a solder ball by the groove portion, and
- a solder ball mounted on the solder ball mounting pad.
A tape carrier for a semiconductor device, comprising:
- a tape substrate formed of a resin insulating film;
- a wiring pattern, formed of a metal foil, provided on one side of the tape substrate;
- a bonding pad, for connection to a semiconductor, provided on one end of the wiring pattern;
- a solder ball mounting pad provided on the other end of the wiring pattern or in a portion between two ends of the wiring pattern;
- an insulating film provided on the surface of the wiring pattern in the region of the solder ball mounting pad while leaving a via hole for a solder ball;
- a window hole for wire bonding of the bonding pad to an electrode in a semiconductor element;
- and
- a strip-shaped groove portion for preventing the flow of a mold resin into the via hole for a solder ball at the time of sealing, with a mold resin, of a connection, between the bonding pad and a semiconductor element, formed in the wire bonding of the bonding pad to an electrode in the semiconductor element, said strip-shaped groove portion having a flat shape in section and being provided along the window hole on the surface of the insulating film present between the window hole and the via hole, for a solder ball, close to the window hole.
Dependencies are inferred from the claim text.