Die-up ball grid array package with a heat spreader and method for making the same
AssigneeBroadcom Corporation
InventorsTonglong Zhang, Reza-Ur Rahman Khan
Life of this patent
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Abstract
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is received. A heat spreader has a first surface and a second surface. The first heat spreader surface is attached to the second substrate surface. A plurality of solder balls are attached to the second substrate surface outside an outer dimensional profile of the heat spreader. The second heat spreader surface is configured to be coupled to a printed circuit board (PCB).
Claims37
A ball grid array (BGA) package, comprising:
- a substrate that has a first surface and a second surface;
- a heat spreader that has a first surface and a second surface, wherein said first heat spreader surface is attached to said second substrate surface;
- and
- a plurality of solder balls attached to said second substrate surface outside an outer dimensional profile of said heat spreader;
- wherein said second heat spreader surface is configured to be coupled to a printed circuit board (PCB).
A method of assembling a ball grid array (BGA) package, comprising the steps of:
- receiving a substrate that has a first surface and a second surface;
- attaching a first surface of a heat spreader to the second substrate surface;
- configuring a second surface of the heat spreader to be coupled to a printed circuit board (PCB);
- and
- attaching a plurality of solder balls to the second substrate surface outside an outer dimensional profile of the heat spreader.
Dependencies are inferred from the claim text.