Millimeter wave (MMW) transceiver module with transmitter, receiver and local oscillator frequency multiplier surface mounted chip set
AssigneeXytrans, Inc.
InventorDanny F. Ammar
Life of this patent
Estimating the term…
Abstract
A millimeter wave (MMW) transceiver module includes a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on a circuit board. The MMIC transceiver chip set includes a receiver MMIC chip package, a transmitter MMIC chip package, and a local oscillator (LO) multiplier MMIC chip package. Each MMIC chip package includes a base and a multilayer substrate board formed from layers of low temperature transfer tape. The multilayer substrate board has at least three layers and carries RF signals, DC signals, grounding and embedded passive components, including resistors and capacitors. At least one MMIC chip is received on the multilayer substrate board.
Claims20
A millimeter wave (MMW) transceiver module comprising:
- a circuit board;
- and
- a microwave monolithic integrated circuit (MMIC) transceiver chip set that is surface mounted on the circuit board, said MMIC transceiver chip set further comprising,
- a receiver MMIC chip package, a transmitter MMIC chip package and a local oscillator (LO) multiplier MMIC chip package that are each surface mounted on the circuit board and operatively connected to each other for millimeter wave transceiver operation, each MMIC chip package including
- a base;
- a multilayer substrate board formed from layers of low temperature transfer tape and received on said base plate, said multilayer substrate board having at least three layers and carrying RF signals, DC signals, grounding, and embedded passive components including resistors and capacitors;
- and
- at least one MMIC chip received on the multilayer substrate.
A microwave monolithic integrated circuit (MMIC) transceiver chip set for surface mounting on a circuit board and forming a millimeter wave (MMW) transceiver module comprising:
- a receiver MMIC chip package, a transmitter MMIC chip package and a local oscillator (LO) multiplier MMIC chip package, each MMIC chip package comprising,
- a base;
- a multilayer substrate board formed from layers of low temperature transfer tape and received on said base, said multilayer substrate board having at least three layers and carrying RF signals, DC signals, grounding, and embedded passive components including resistors and capacitors;
- at least one MMIC chip received on the multilayer substrate;
- said receiver MMIC chip package including a low noise amplifier, a mixer and image reject filter;
- said transmitter MMIC chip package including a mixer, power amplifier and local oscillator signal reject filter;
- and
- said local oscillator multiplier MMIC chip package including an amplifier, mixer, feedback loop circuit and filter for filtering any fundamental frequency.
A method of forming a millimeter wave (MMW) transceiver module comprising the step of:
- surface mounting on a circuit board a receiver MMIC chip package, a transmitter MMIC chip package and a local oscillator (LO) multiplier MMIC chip package, each chip package comprising,
- a base;
- a multilayer substrate board formed from layers of low temperature transfer tape and received on said base plate, said multilayer substrate board having at least three layers and carrying RF signals, DC signals, grounding, and embedded passive components including resistors and capacitors;
- at least one MMIC chip received on the multilayer substrate;
- said receiver MMIC chip package including a low noise amplifier, a mixer and image reject filter;
- said transmitter MMIC chip package including a mixer, power amplifier and local oscillator signal reject filter;
- and
- said local oscillator multiplier MMIC chip package including an amplifier, mixer, feedback loop circuit and filter for filtering any fundamental frequency.
Dependencies are inferred from the claim text.