Semiconductor device with stack of semiconductor chips
AssigneeFujitsu Limited
InventorsTetsuya Hiraoka, Akira Takashima
Life of this patent
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Abstract
A semiconductor device is configured of a first semiconductor chip mounted on a substrate, a plate member arranged on the first semiconductor chip, and a second semiconductor chip arranged on the plate member. Bonding wires electrically connect the pads of the first semiconductor chip and the pads of the second semiconductor chip to the pads of the substrate, and a sealing resin seals the first semiconductor chip and the second semiconductor chip. A first portion of the plate member is displaced away from the ends of the first and second semiconductor chips, and a second portion of the plate member extending perpendicular to the first portion, projects outward from the first and second semiconductor chips to be exposed to the outside.
Claims6
A semiconductor device comprising:
- a substrate having pads;
- a first semiconductor chip mounted on said substrate and having pads;
- a plate member arranged on said first semiconductor chip and having an end at an inward position of said first semiconductor chip from the pads;
- a second semiconductor chip arranged on said plate member and having pads;
- a structure electrically connecting said pads of said first semiconductor chip and said pads of said second semiconductor chip to said pads of said substrate;
- and
- a seal member sealing said first semiconductor chip and said second semiconductor chip.
Dependencies are inferred from the claim text.