Reworkable and thermally conductive adhesive and use thereof
AssigneeInternational Business Machines Corporation
InventorsStephen Buchwalter, Michael Anthony Gaynes, Nancy C. LaBianca, Stefano Sergio Oggioni, Son K. Tran
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Abstract
Reworkable thermally conductive adhesive composition comprising a cured reaction product from a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler are provided and used to bond semiconductive devices to a chip carrier or heat spreader.
Claims35
A packaging structure comprising at least one semiconductor device bonded to a chip carrier or heat spreader with an adhesive, wherein the adhesive is reworkable and thermally conductive and comprises a cured reaction product from a diepoxide and cyclic anhydride wherein the epoxy groups are connected through an acyclic acetal moiety;
- and a thermally conductive filler.
A method for fabricating a packaging structure which comprises bonding at least one semiconductor device to a chip carrier by applying a composition comprises a diepoxide wherein the epoxy groups are connected through an acyclic acetal moiety, a cyclic anhydride and a thermally conductive filler;
- and curing the composition to provide a reworkable and thermally conductive adhesive.
A reworkable thermally conductive adhesive composition comprising a) about 20 to about 60% by weight of a cured reaction product from diepoxide and a cyclic anhydride wherein the epoxy groups are connected through an acyclic acetal moiety b) about 40 to about 79% by weight of a thermally conductive filler;
- c) about 0.05 to about 2% by weight of a thixotropic agent based upon the total a), b), and c) in the composition.
Dependencies are inferred from the claim text.