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US 2002/0171130 A1Published application
Tape carrier package
AssigneeOki Electric Industry Co., Ltd.
InventorsYoshikazu Takahashi, Kaname Kobayashi
Life of this patent
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Abstract
A tape carrier in which a plurality of semiconductor elements can be mounted. The tape carrier includes a base tape on which device holes are formed and a plurality of leads provided on the base tape, wherein inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, are of different lengths.
Claims32
A semiconductor package comprising:
- a tape carrier;
- a first semiconductor element having a surface and a first electrode, on which surface the first electrode is provided;
- a longer lead which is provided on the tape carrier and connected to the first electrode;
- a second semiconductor element having a surface and a second electrode, on which surface the second electrode is provided, and the first semiconductor element is stacked;
- a shorter lead which is provided on the tape carrier and connected to the second electrode and is shorter than the longer lead;
- and
- a resin material which seals the first semiconductor element, the second semiconductor element, the longer lead and the shorter lead.
4 more elements
A semiconductor package comprising:
- a tape carrier;
- a first semiconductor element having a surface and a first electrode, on which surface the first electrode is provided;
- a longer lead having two ends and a first land, the one end being connected to the first electrode and the other end forming the first land on the tape carrier;
- a second semiconductor element having a surface and a second electrode, on which surface the second electrode is provided, and the first semiconductor element is stacked;
- a shorter lead having two ends and a second land, the one end being connected to the second electrode and the other end forming a second land on the tape carrier;
- a resin material which seals the first semiconductor element, the second semiconductor element, the longer lead and the shorter lead;
- and
- solder balls, which are mounted on the first and second lands for external connection.
5 more elements
A tape carrier comprising:
- a base tape having a device hole formed therein;
- and
- leads, which include inner lead portions, are provided on the base tape, wherein
- the inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, have different lengths.
1 more element
A tape carrier package comprising:
- a base tape;
- a first semiconductor element having an upper surface and a first electrode, on which upper surface the first electrode is provided;
- a first lead, which first lead is provided on the base tape and connected to the first electrode;
- a second semiconductor element having an upper surface and a second electrode, on which upper surface the second electrode is provided,
- a second lead, which is shorter than the first lead, and is provided on the base tape and connected to the second electrode;
- a third semiconductor element having an upper surface and a third electrode, on which upper surface the third electrode is provided;
- a third lead, which is shorter than the second lead, provided on the base tape and connected to the third electrode;
- and
- a molding member, which seals the first semiconductor element, the second semiconductor element, the third semiconductor element, the first lead, the second lead and the third lead.
6 more elements
A tape carrier package, comprising:
- a base tape;
- a first semiconductor element having upper and lower surfaces and a first electrode, on which upper surface the first electrode is provided;
- a first lead, which is provided on the base tape and connected to the first electrode;
- a second semiconductor element having upper and lower surfaces and a second electrode, on which upper surface the second electrode is provided, the second semiconductor element being disposed such that the side surfaces of the first semiconductor element and the second semiconductor element are opposite each other, with a space formed therebetween;
- a first lead which is provided on the base tape and connected to the second electrode;
- a third semiconductor element having an upper surface and a third electrode, on which upper surface the third electrode is provided, and which is disposed at lower surface side of the first semiconductor element and the second semiconductor element;
- a second lead which is shorter than the first lead, provided on the base tape and connected to the third electrode;
- a molding member which seals the first semiconductor element, the second semiconductor element, the third semiconductor element, and the first lead and the second lead, wherein
- both the lower surface of the first semiconductor element and the lower surface of the second semiconductor element are adhered to the upper surface of the third semiconductor element.
6 more elements
A tape carrier package comprising:
- a base tape;
- a first semiconductor element having an upper surface and a first electrode, on which upper surface the first electrode is provided;
- a first lead, which is provided on the base tape and connected to the first electrode;
- a second semiconductor element on which upper surface a second electrode is provided;
- a third semiconductor element having an upper surface and a third electrode, on which upper surface the third electrode is provided, the third semiconductor element being disposed such that the side surfaces of the second semiconductor element and the third semiconductor element are opposite each other and a space is formed therebetween;
- a second lead, which is shorter than the first lead, the second lead being provided on the base tape and connected to the second electrode and the third electrode;
- and
- a molding member which seals the first semiconductor element, the second semiconductor element, the third semiconductor element, the first lead and the second lead, wherein
- the lower surface of the first semiconductor element is adhered to both the upper surface of the second semiconductor element and the upper surface of the third semiconductor element.
6 more elements
A tape carrier package comprising:
- a base tape;
- a first semiconductor element having a lower surface, on which lower surface a first electrode is provided;
- a first lead, which is provided on the base tape and connected to the first electrode;
- a second semiconductor element having an upper surface, on which upper surface a second electrode is provided;
- a second lead, which is shorter than the first lead, and is provided on the base tape and connected to the second electrode;
- and
- a molding member which seals the first semiconductor element, the second semiconductor element, and the first lead and the second lead, wherein
- the second semiconductor element is held so as to be spaced apart from the lower surface side of the first semiconductor element.
5 more elements
A tape carrier comprising:
- a base tape having a device hole;
- lands, which are provided on the base tape and arranged in a grid pattern;
- a plurality of leads, each having an outer lead portion and an inner lead portion, which outer lead portions are connected to the plurality of lands;
- a solder resist provided on the lead which includes an opening through which the land is exposed;
- and
- a metal ball which is connected to the land via the opening, wherein
- the inner lead portions, which extend from the periphery of the device hole toward the center of the device hole, having several different lengths.
4 more elements
A tape carrier comprising:
- a base tape having a device hole formed therein and a lower surface;
- lands, provided on the base tape and arranged in a grid pattern;
- openings through which the lands are exposed to the lower surface side of the base tape;
- leads having outer leads and inner leads, the outer lead portions being connected to the plurality of lands;
- a solder resist provided on the leads;
- and
- a metal ball which is connected to the land via the opening, wherein
- inner lead portions of the leads which extend from the periphery of the device hole toward the center of the device hole have several different lengths.
5 more elements
Dependencies are inferred from the claim text.