Semiconductor device and method for producing the same
AssigneeOki Electric Industry Co., Ltd.
InventorsSyuichi Yamanaka, Tomiichi Shibata
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Abstract
This invention is directed to preventing deformation, breakage, and the like of leads in a semiconductor device, reducing a fraction defective, and making the semiconductor device smaller and thinner. In order to accomplish these objects, in a carrier including a base having a device hole and a plurality of leads for bonding a chip, the leads are provided with thin heat-resistant films.
Claims17
A carrier for use with a chip, the carrier comprising a base having formed therein a hole for receiving the chip, a plurality of leads disposed on the base for bonding to the chip, and thin heat-resistant films provided on the leads.
A semiconductor device comprising a chip mounted on a carrier including a device hole supporting the chip, the carrier comprising leads bonded to the chip.
Dependencies are inferred from the claim text.