Apparatus for routing signals
AssigneeHewlett-Packard Development Company, L.P.
InventorsJames P. Slupe, Timothy V. Harper, Fred R. Wiedeback
Life of this patent
Estimating the term…
Abstract
An apparatus for routing signals to and from at least one circuit component that has a plurality of input/output leads includes a support structure having a first side and a second side. The first side is adapted to have the input/output leads of the circuit component attached thereto. A signal routing strip having a first end and a second end is also included. The first end of the routing strip is configured and adapted to be electrically connected to the input/output leads of the circuit component for transmitting signals to and from the circuit component.
Claims24
Apparatus for routing signals to and from a plurality of input/output leads on at least one circuit component, said apparatus comprising:
- a strip having a first side and a second side, and a first end and a second end;
- a plurality of electrically conductive traces imbedded in said strip between said first side and said second side;
- and,
- a plurality of electrical terminals extending from said conductive traces and protruding from said strip at said first end and said second end on at least said first side, wherein said terminals at said first end of said strip are configured and adapted to be connected to the plurality of input/output leads on a first circuit component to route signals to and from the first circuit component from and to said terminals at said second end of said strip.
Apparatus for routing signals to and from at least one circuit component having a plurality of input/output leads, said apparatus comprising:
- a support structure having a first side and a second side, said first side being adapted to have the input/output leads of the at least one circuit component attached thereto;
- and,
- a signal routing strip having a first end and a second end, said first end being configured and adapted to be electrically connected to the input/output leads of the at least one circuit component for transmitting signals to and from the circuit component.
An integrated circuit device comprising:
- a die for performing functions of said integrated circuit device, and having a plurality of input/output terminals;
- a package configured and adapted to receive said die, and having a first surface and a an opposing second surface;
- and,
- a plurality of external connection leads formed on said first surface and said second surface of said package;
- wherein said input/output terminals of said die are electrically connected to said external connection leads on said first surface and said top surface of said package.
A stackable integrated circuit device adapted to have at least one circuit component attached thereto, said device comprising:
- a die for performing functions of said integrated circuit device, and having a plurality of input/output terminals;
- a package configured and adapted to receive said die, and having a first surface and an opposing second surface;
- and,
- a plurality of external connection leads formed on said first surface and said second surface of said package, said external connection leads being electrically connected to said input/output terminals of said die;
- wherein said external connection leads on said first surface are configured and adapted to be connected to corresponding input and output leads of the circuit component placed over said first surface of said package.
Dependencies are inferred from the claim text.