Power chip scale package
AssigneeFairchild Semiconductor Corporation
InventorsMaria Cristina B. Estacio, Ruben Madrid
Life of this patent
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Abstract
A packaging arrangement for a semiconductor device including a leadframe and a die coupled thereto. The die is coupled to the leadframe such that its back surface (drain area) is coplanar with source leads and a gate lead extending from the leadframe. A stiffener is coupled to the leadframe and electrically isolated therefrom in order to help maintain the position of the source and gate pads of the leadframe. When the semiconductor device is coupled to a printed circuit board (PCB), the exposed surface of the die serves as the direct drain connections while the source leads and gate leads serve as the connections for the source and gate regions of the die.
Claims14
A semiconductor device comprising:
- a. a leadframe comprising:
- i. a source pad;
- ii. at least two source lead rails at a periphery of the source pad;
- iii. a gate pad adjacent the source pad and electrically isolated therefrom;
- and
- iv. gate lead rail at a periphery of the gate pad;
- b. a die coupled to the source pad and the gate pad;
- and
- c. a stiffener coupled to the leadframe and electrically isolated therefrom.
A method of making a semiconductor device, the method comprising:
- providing a leadframe comprising:
- a. a source pad;
- b. at least two source lead rails at a periphery of the source pad;
- c. a gate pad adjacent the source pad and electrically isolated therefrom;
- and
- d. a gate lead rail at a periphery of the gate pad;
- flipping a bumped die including a plurality of solder bumps onto the source and gate pads;
- and
- reflowing the solder bumps.
A semiconductor device comprising:
- a. a leadframe including first and second surfaces;
- b. a die coupled to the first surface;
- and
- c. a stiffener coupled to the second surface and electrically isolated therefrom.
A method of making a semiconductor device, the method comprising:
- providing a leadframe including a first surface and a second surface;
- coupling a die to the first surface with solder;
- and
- reflowing the solder.
Dependencies are inferred from the claim text.