Insulators for high density circuits
AssigneeMicron Technology, Inc.
InventorPaul A. Farrar
Life of this patent
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Abstract
A conductive system and a method of forming an insulator for use in the conductive system is disclosed. The conductive system comprises a foamed polymer layer on a substrate. The foamed polymer layer has a surface that is hydrophobic, and a plurality of conductive structures are embedded in the foamed polymer layer. An insulator is formed by forming a polymer layer having a thickness on a substrate. The polymer layer is foamed to form a foamed polymer layer having a surface and a foamed polymer layer thickness, which is greater than the polymer layer thickness. The surface of the foamed polymer layer is treated to make the surface hydrophobic.
Claims46
An integrated circuit structure comprising:
- a substrate;
- a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers has a surface that is hydrophobic, and each of the foamed polymer layers has a cell size less than about one micron;
- and
- a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.
An integrated circuit structure comprising:
- a substrate;
- a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic;
- and
- a plurality of conductive structures embedded in the foamed material layer.
An integrated circuit structure comprising:
- a substrate;
- a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic;
- and
- a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.
An integrated circuit structure comprising:
- a substrate;
- a plurality of stacked foamed polyimide layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic;
- and
- a plurality of conductive structures embedded in each of the plurality of foamed polymer layers.
An integrated circuit structure comprising:
- a substrate;
- a plurality of electronic devices on the substrate;
- and
- an air-bridge structure coupling two of the electronic devices, the air-bridge structure having a surface that is hydrophobic.
An integrated circuit structure comprising:
- a substrate;
- a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic;
- and
- a plurality of conductive structures embedded in the foamed material layer;
- the foamed material layer formed by exposing an unfoamed material layer to a supercritical fluid to form the foamed material layer.
An integrated circuit structure comprising:
- a substrate;
- a foamed material layer on the substrate, the foamed material layer having a surface that is hydrophobic;
- and
- a plurality of conductive structures embedded in the foamed material layer;
- the surface of the foamed material layer formed hydrophobic by exposing the surface of the foamed material layer to a plurality of methane radicals.
An integrated circuit structure comprising:
- a substrate;
- a plurality of stacked foamed polymer layers on the substrate, each of the stacked foamed polymer layers having a surface that is hydrophobic;
- and
- a plurality of conductive structures embedded in each of the plurality of foamed polymer layers;
- the foamed polymer layers having a hydrophobic surface being formed by exposing an unfoamed polymer layer to a supercritical fluid to form the foamed polymer layer, and exposing the surface of each foamed polymer layer to a plurality of methane radicals.
An integrated circuit structure comprising:
- a substrate;
- a plurality of stacked foamed aerogel layers on the substrate, each of the stacked foamed aerogel layers having a surface that is hydrophobic;
- a plurality of conductive structures embedded in each of the plurality of foamed polymer layers;
- and
- the foamed aerogel layers having a hydrophobic surface being formed by exposing an unfoamed aerogel layer to a supercritical fluid to form the foamed aerogel layer, and exposing the surface of each foamed aerogel layer to a plurality of methane radicals.
An integrated circuit structure comprising:
- a substrate;
- a plurality of electronic devices on the substrate;
- and
- an air-bridge structure coupling two of the electronic devices, the air-bridge structure having a surface that is hydrophobic;
- the surface of the air-bridge structure being made hydrophobic by exposing the surface of the air-bridge structure to a plurality of methane radicals.
Dependencies are inferred from the claim text.