Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument
AssigneeRicoh Company, Ltd.
InventorsMinoru Igarashi, Katsuhiko Mukai, Masashi Isoda, Takayuki Kobayashi
Life of this patent
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Abstract
A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the other side surface of the print circuit baseboard with a jet flow solder process. Either a composition or a melting point of alloys generated when the reflow and flow soldering are performed is differentiated so that the alloy on one side surface does not melt during a flow soldering process to the other side surface.
Claims21
A method for soldering parts mounted on a baseboard, comprising the steps of:
- mounting parts on both side surfaces of the baseboard;
- performing reflow soldering to parts mounted on one side surface of the baseboard with a prescribed reflow solder;
- performing flow soldering to parts mounted on the other side surface of the baseboard with a prescribed jet flow solder;
- producing alloys on the respective surfaces after the reflow and flow soldering are performed;
- and
- differentiating either a composition or a melting point of the alloy so that the alloy on the one side surface does not melt during the flow soldering to the other side surface.
A method for soldering parts mounted on a baseboard, comprising the steps of:
- mounting parts on both side surfaces of the baseboard;
- performing reflow soldering to parts mounted on one side surface of the baseboard with prescribed Pb excluding material made of a Sn—Pb eutectic as a base;
- performing flow soldering to parts mounted on another side surface of the baseboard with a prescribed jet flow solder;
- and
- producing alloys on the respective surfaces after the reflow and flow soldering are performed.
A method for soldering parts mounted on a baseboard, comprising the steps of:
- mounting parts on both side surfaces of the baseboard;
- performing reflow soldering to parts mounted on one side surface of the baseboard;
- performing jet flow soldering to parts mounted on the other side surface of the baseboard;
- producing prescribed alloys on both side surfaces, respectively, after respective reflow and flow soldering are performed;
- and
- controlling a temperature of the alloy on the one side surface not to reach a solid phase line temperature enabling the lower melting point alloy to melt during the flow soldering.
A method for soldering parts mounted on a baseboard, comprising the steps of:
- mounting parts in first and second areas on one side surface of the baseboard;
- performing reflow soldering to parts mounted on the first area with a prescribed reflow solder;
- performing flow soldering to parts mounted on the second area with a prescribed jet flow solder;
- producing alloys on the respective areas after the reflow and flow soldering are performed;
- and
- differentiating either a composition or a melting point of the alloy so that the alloy on the first area does not melt during the flow soldering to the second area.
A method for soldering parts mounted on a baseboard with Pb-free material, comprising the steps of:
- mounting parts on both side surfaces of the baseboard;
- performing reflow soldering to parts mounted on one side surface of the baseboard;
- performing flow soldering to parts mounted on one side surface of the baseboard with jet flow solder;
- producing alloys on both side surfaces, respectively, after the reflow and flow soldering are performed;
- and
- controlling a temperature of the alloy on the one side surface to exceed a liquid phase line temperature enabling a higher melting point alloy to melt during the flow soldering.
Dependencies are inferred from the claim text.