Soldering method and soldering apparatus

A soldering apparatus for soldering plural soldering points of a workpiece, the plural soldering point being aligned at a predetermined interval, comprising:

• plural trowel members each having a surface made of a solder repellent material at least the portion contacting with a solder, said plural trowel members being engaged together to form a solder melting pot and separated from each other to supply the molten solder to the soldering point, a solder tip having a constant volume being supplied to said solder melting pot to be molten and then allowed to drop when said plural trowel members are separated from each other;
• an additional heating portion which is formed to said trowel members in close vicinity to said solder melting pot and additionally heats an adjacent soldering point to which the molten solder has been already supplied during an operation of said solder melting pot for supplying the molten solder to the next soldering point;
• a workpiece holder for relatively moving the workpiece with respect to said trowel members along an alignment direction of the plural soldering points;
• and
• a controller for moving said workpiece holder and controlling said trowel members in synchronism with the relative movement of the workpiece, so that said trowel members are moved up and down and/or opened and closed to supply the molten solder from said solder melting pot to each of the soldering points of the workpiece.