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US 2002/0170945 A1Published application
Solder ball attachment system
AssigneeIntel Corporation
InventorShafarin Shafie
Life of this patent
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Abstract
A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.
Claims27
A solder ball attachment system, comprising:
- a flux station adapted to apply flux onto a substrate;
- a solder ball placement station adapted to place solder balls onto the substrate;
- and
- a conveyor assembly adapted to move the substrate between the flux station and the solder ball placement station.
1 more element
A solder ball attachment system, comprising:
- a flux station including a flux screen having a plurality of openings formed therein in a predetermined pattern adapted to apply flux onto a substrate according to the predetermined pattern;
- a solder ball placement station including a solder ball placement mask having a plurality of placement holes formed therein in a selected pattern to place solder balls on the flux according to the selected pattern;
- and
- a conveyor assembly adapted to move the substrate between the flux station and the solder ball placement station.
1 more element
A method for placing solder balls on a substrate, comprising:
- applying flux to the substrate according to a predetermined pattern at a flux station;
- conveying the substrate from the flux station to a solder ball placement station;
- and
- depositing solder balls on the flux according to a selected pattern at the solder ball placement station.
1 more element
Dependencies are inferred from the claim text.