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US 2002/0170943 A1Published application
Solder bonding technique for assembling a tilted detector chip
AssigneeJDS Uniphase Corporation
InventorPhilip Deane
Life of this patent
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Abstract
A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of asymmetric solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. This causes the chip to tilt to one side about the axis defined by the asymmetric pads.
Claims8
A method of bonding an element to a substrate, the method comprising:
- a) providing a substrate having a generally flat surface,
- b) placing two or more solder bumps on either the substrate or on the element, the bumps defining a single axis,
- c) providing means for asymmetrical flow of the solder bumps upon melting,
- d) effecting a contact of the element with the substrate via the solder bumps, and
- e) heating the solder bumps to cause a non-uniform flow of the solder bumps and a tilting displacement of the element substantially about the axis defined by the solder bumps.
2 more elements
Dependencies are inferred from the claim text.