Methods for preparing ball grid array substrates via use of a laser
OwnerFrank L. Hallinventor
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Abstract
The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.
Claims23
A resist removal method comprising:
- providing a substrate having a surface;
- forming resist on at least a portion of the surface;
- and
- providing a laser to remove the resist from the substrate.
A semiconductor device formed by a laser etching process comprising:
- providing a substrate having a surface;
- forming resist on at least a portion of the surface;
- and
- etching the resist from the surface c f the substrate using a laser.
A method of fabricating a semiconductor device comprising:
- providing a substrate having a surface;
- forming resist on at least a portion of the surface;
- laser etching the resist from the surface of the substrate;
- and encapsulating the substrate.
A method of enhancing the adhesion of a compound to a surface of a substrate comprising:
- providing a substrate having a surface;
- roughening the surface of the substrate.
The method according to claim 21 wherein said roughening comprises removing contamination and foreign particles from said surface of the substrate.
An automolding system comprising:
- providing a substrate having a surface;
- preheating the substrate;
- forming a resist layer;
- baking the substrate;
- and
- removing contaminants from the substrate using a laser.
Dependencies are inferred from the claim text.