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US 2002/0170890 A1Published application
Precision spray processes for direct write electronic components
OwnerDavid M. Keicher, W. Doyle Miller +1inventors
InventorsDavid M. Keicher, W. Doyle Miller, Marcelino Essien
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Abstract
This invention combines the precision spray process with in-flight laser treatment in order to produce direct write electronic components. In addition to these components, the process can lay down lines of conductive, inductive, and resistive materials. This development has the potential to change the approach to electronics packaging. This process is revolutionary in that components can be directly produced on small structures, thus removing the need for printed circuit boards.
Claims24
A method for direct material deposition on a substrate, said method comprising:
- (a) passing one or more feedstocks through a laser beam under conditions sufficient to convert substantially all of said feedstock(s) into a depositable form, and
- (b) depositing said depositable feedstock(s) on said substrate,
- wherein said laser beam is generated by at least one laser, each operating at a power of up to about 1 kW.
Dependencies are inferred from the claim text.