Multilayer substrate for a buildup with a via, and method for producing the same
OwnerShuichi Furuyainventor
Life of this patent
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Abstract
A multilayer substrate for a buildup with a via, which multilayer substrate comprises a base material comprising an insulation resin layer on which a predetermined hole is formed, wherein an electrodeposition layer is formed by circular oscillation electroplating on the inside wall surface of the hole and on the predetermined surface of the insulation resin layer, the electrodeposition layer on the inside wall surface of the hole being formed in a thickness greater than the electrodeposition layer formed on the surface of the insulation resin layer and a method for the production of the substrate.
Claims25
A multilayer substrate for a buildup with a via, which multilayer substrate comprises a base material comprising an insulation resin layer and, if necessary, a copper layer or an extra thin copper foil formed on either one or both surfaces of said insulation resin layer, and which multilayer substrate has a predetermined hole formed on said insulation resin layer,
- wherein an electrodeposition layer is formed by circular oscillation electroplating on the inside wall surface of said hole and on the predetermined surface of said insulation resin layer,
- the electrodeposition layer on said inside wall surface of said hole being formed in a thickness greater than the electrodeposition layer formed on said surface of said insulation resin layer.
A method for producing a multilayer substrate for a buildup with a via, comprising:
- a step of forming a predetermined hole using a laser in a base material comprising an insulation resin layer and, if necessary, a copper layer or an extra thin copper foil formed on either one or both surfaces of said insulation resin layer;
- a step of performing electroless plating, copper sputtering or activating treatment on the base material on which said hole is formed;
- and
- an electroplating step of performing electroplating to generate a vortex flow of an electroplating solution inside said hole by oscillating said base material circularly in an electroplating bath, to form an electrodeposition layer on the inside wall surface of said hole and on a predetermined surface of said insulation resin layer, whereby the electrodeposition layer on the inside wall surface of said hole is formed in a thickness larger than the electrodeposition layer formed on said surface of said insulation resin layer.
Dependencies are inferred from the claim text.