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US 2002/0170746 A1Published application
Organic packages with solders for reliable flip chip connections
OwnerRaj N Master, Mohammed Zubair Khan +2inventors
InventorsRAJ N MASTER, MOHAMMED ZUBAIR KHAN, MARIA GUARDADO, CHARLES ANDERSON
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Abstract
An organic carrier member for mounting a semiconductor device is provided that has a plurality of solder pads containing low amounts of tin. Embodiments include a bismaleimide-triazine epoxy laminate having a plurality of solder pads on the top surface thereof where the solder pads contain no more than about 20 weight percent tin and has a reflow temperature of no greater than about 270° C.
Claims18
A carrier member for mounting a device, the member comprising:
- an organic substrate having a top surface and a bottom surface;
- a plurality of solder pads on the top surface of the organic substrate for receiving the device to be mounted thereto, wherein the solder pads comprises no more than about 60 wt % tin and has a reflow temperature of no greater than about the decomposition temperature of the organic substrate;
- and
- a plurality of electrical connections on the bottom surface of the organic substrate which are in electrical communication with the solder pads on the top surface of the organic substrate.
1 more element
A carrier member for mounting a device, the member comprising:
- a substrate comprising a bismaleimide-triazine epoxy laminate having a top surface and a bottom surface;
- a plurality of solder pads on the top surface of the substrate for receiving a device to be mounted thereto, wherein the solder pads comprises no more than about 20 wt % tin and has a reflow temperature of no greater than about 270° C.;
- and
- a plurality of electrical connections on the bottom surface of the organic substrate which are in electrical communication with the solder pads on the top surface of the substrate.
1 more element
Dependencies are inferred from the claim text.