US 2002/0170745 A1 · Multilayer board combound and method for the manufacture thereof

Abstract

A multilayer printed board compound comprises at least two planely superposed printed boards, each of which having an electrically insulating mother board, electrically conductive circuit paths, which are provided on at least one side of the mother board, and recesses, which are defined laterally by the circuit paths and towards the mother board by the mother board; and at least one preimpregnated board, which is disposed between the printed boards for joining the printed boards; wherein the recesses, which are disposed between the mother boards of the respective printed boards, are filled substantially entirely with a synthetic resin paste; and wherein the at least two printed boards and the at least one preimpregnated board are joined by pressing.

Claims18

Dependent claims

A multilayer printed board compound (5), comprising

at least two printed boards (9), which are disposed planely one above the other and each of which comprises
an electrically insulating mother board (10),
electrically conductive circuit paths (11), which are provided on at least one side of the mother board (10), and
recesses (12), which are defined laterally by the circuit paths (11) and towards the mother board (10) by the mother board (10);
and
at least one preimpregnated board (14) disposed between the printed boards (9) for joining the printed boards (9);
wherein the recesses (12), which are disposed between the mother boards (10) of the respective printed boards (9), are substantially completely filled with a synthetic resin paste (13);
and
wherein the at least two printed boards (9) and the at least one preimpregnated board (14) are joined by pressing.

6 more elements

Dependencies are inferred from the claim text.

Multilayer board combound and method for the manufacture thereof

Life of this patent

Multilayer board combound and method for the manufacture thereof

Life of this patent

Abstract

Claims18