System and method of processing composite substrates within a high throughput reactor
OwnerMichael J. Tanguayinventor
Life of this patent
Estimating the term…
Abstract
A wafer susceptor for use in a substrate processing system, comprising of at least one recess formed therein, with each recess arranged and configured to hold at least one substrate therein, wherein a combination of the wafer holder and said at least one substrates form a composite substrate having uniform processing characteristics.
Claims49
A wafer susceptor for use in a substrate processing system, comprising:
- at least one recess formed therein, with each recess is arranged and configured to hold at least one substrate therein, wherein a combination of said wafer holder and said at least one substrate forms a composite substrate having uniform processing characteristics.
The wafer susceptor of claim 3, wherein said physical properties comprise at least one property selected from the group consisting of:
- Thermal coefficient of expansion;
- Reflectivity;
- Thermal mass;
- Thermal conductivity;
- Electrical resistivity;
- Dielectric constant;
- Dielectric loss;
- Density;
- Hardness;
- and
- Emissivity.
- The wafer susceptor, wherein said wafer susceptor is used in a semiconductor substrate processing system, comprising a reactor having at least one single substrate deposition chambers, and further comprising an automated substrate transport assembly including a wand array comprising a plurality of wands constructed and arranged to simultaneously transport a corresponding plurality of substrates into and out of the deposition chamber.
The system of claim 5, further comprising an automated substrate transport assembly arranged for serially transporting single ones of a plurality of substrates into and out of the deposition chamber.
The system of claim 5, further comprising an automated substrate transport assembly.
The system of claim 7, further comprising a substrate cassette for storage and bulk transport of plural arrays of substrates, and position able in substrate pickup and substrate delivery relationship to the automated substrate transport assembly.
The system of claim 8, further comprising an automated substrate transport assembly including a wand array comprising a plurality of wands constructed and arranged to simultaneously transport a corresponding plurality of substrates into and out of the deposition chamber, wherein the automated substrate transport assembly and substrate cassette are constructed and arranged so that when the automated substrate transport assembly is translated into a pickup position relative to the substrate cassette, said plurality of wands engage and extract a plurality of substrates from the substrate cassette, with each wand engaging and extracting a substrate from a different one of said plural arrays of substrates, and so that when the automated substrate transport assembly is translated into a deposit position relative to the substrate cassette, said plurality of wands release and deposit a plurality of substrates on the substrate cassette, with each wand releasing and depositing a substrate into a different one of said plural arrays of substrates.
The system of claim 19, wherein the substrate cassette is constructed and arranged for holding two arrays of substrates, wherein all substrates are planar and each respective substrate in a first array is generally coplanar with a corresponding respective substrate in a second array.
The system of claim 20, wherein the first and second arrays are parallel to one another.
A method of increasing the throughput of a single substrate deposition chamber, said method comprising:
- positioning in said single substrate deposition chamber a wafer susceptor having at least one recess formed therein, with each recess being arranged and configured to hold at least one substrate therein, wherein a combination of said wafer susceptor and at least one substrate form a composite substrate having uniform processing characteristics.
Dependencies are inferred from the claim text.