Method for producing ceramic substrate

A method for manufacturing a ceramic substrate, comprising the steps of:

• forming a conductive pattern through filling an intaglio with a conductive paste;
• forming an adhesive layer on a sintered ceramic substrate;
• heat-pressing the intaglio onto the adhesive layer;
• removing the intaglio;
• and
• forming a first assembly through stacking an un-sintered green sheet to cover the conductive pattern and through heat-pressing the un-sintered green sheet.

A method for manufacturing a ceramic substrate, comprising the steps of:

• forming a first conductive pattern through filling a first intaglio with a conductive paste;
• forming a first adhesive layer on a first heat-resistant substrate;
• heat-pressing the first intaglio onto the first adhesive layer;
• removing the first intaglio;
• forming a first assembly through stacking an un-sintered green sheet to cover the first conductive pattern and heat-pressing the un-sintered green sheet;
• forming a second conductive pattern through filling a second intaglio with a conductive paste;
• forming a second adhesive layer on a sintered ceramic substrate;
• heat-pressing the second intaglio to the second adhesive layer;
• removing the second intaglio;
• and
• forming a second assembly through stacking the first assembly to cover the second conductive pattern and heat-pressing the first assembly.