Differential Cleaning for semiconductor wafers with copper circuitry
AssigneeSpeedFam-IPEC Corporation
InventorJustin M. Quarantello
Life of this patent
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Abstract
The invention provides a method for differentially applying cleaning chemistries to a silicon wafer that has undergone a polishing process whether chemical mechanical polishing or polishing with a fixed abrasive material. In accordance with the invention, cleaning fluid with a specific chemistry designed for cleaning the front side of the wafer is applied to the front side; while different chemistry specifically selected for more effectively cleaning the rear side of the wafer is applied to that side. This application of different chemistries to the two sides of the wafer is referred to as “differential cleaning”.
Claims25
A method of cleaning a workpiece, comprising:
- selecting a workpiece comprising a first side and a second side, the first side of the workpiece having thereon a contaminant removable with a first cleaning solution, the second side of the workpiece subject to chemical attack by the first cleaning solution;
- applying the first cleaning solution to the first side while minimizing carryover of the first cleaning solution to the second side;
- and
- applying a second cleaning solution to the second side.
A method of cleaning a wafer comprising:
- selecting a wafer comprising a first side comprising semiconductor devices and opposite second side, the second side having thereon a contaminant removable with a cleaning solution, the semiconductors of the workpiece subject to chemical attack by the first cleaning solution;
- applying the cleaning solution to the second side while minimizing carryover of the cleaning solution to the second side;
- and
- applying another cleaning solution to the first side.
A method of cleaning a wafer comprising;
- selecting a wafer comprising a first side and a second side, the first side of the wafer having thereon a contaminant removable with a first cleaning solution, the second side of the wafer comprising semiconductor circuitry, the semiconductor circuitry subject to chemical attack by the first cleaning solution;
- applying the first cleaning solution to the first side of the wafer, the first cleaning solution comprising active fluorine ions in a concentration ranging from about 0.01 to about 2.5M;
- and
- applying a second cleaning solution to the second side of the wafer.
Dependencies are inferred from the claim text.