Multilayer printed circuit board and method for making the same

A method for making a printed circuit board comprising the steps of:

• forming a first conductor pattern on one face and a second conductor pattern on the other face of each of a plurality of core substrates;
• forming a first metal layer comprising a first metal on the first conductor pattern and a second metal layer comprising a second metal on the second conductor pattern of each of the plurality of core substrates, the first metal having a melting point below the heat resistant temperature of the core substrates and the second metal having a melting point above the heat resistant temperature of the core substrates;
• laminating the plurality of core substrates such that the first metal layer on the first conductor pattern of one of the plurality of core substrates faces the second metal layer on the second conductor pattern of the adjacent core substrate;
• and
• bonding the first metal layer and the second metal layer by thermal compression to form an alloy layer comprising the first metal and the second metal.