Dielectronic composition for manufacturing insulating structures
OwnerGerardo Pagaza Melero, Saturnino Enrique Martinez Herrera +1inventors
InventorsGerardo Pagaza Melero, Saturnino Enrique Martinez Herrera, Victor Pagaza Melero
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Abstract
The present invention is related with a dielectric composition for the manufacture of an insulating structure of the type that comprises at least a dielectric resin. The composition comprises granules of a thermoset polymer and a dielectric resin in a ratio thermoset polymer/dielectric resin in the scale of 2:1 to 20:1, which allows it to support voltages of at least 45 kV and to have resistances of at least 25 MΩ. The invention further comprises dielectric structures obtained from the composition, which can be increased in their dielectric strength by means of a layer of dielectric resin.
Claims30
A dielectric composition for the manufacture of an insulating structure of the type that comprises at least a dielectric resin, characterized by comprising granules of a thermoset polymer and a dielectric resin in a ratio of thermoset polymer/dielectric resin in the scale of 2:1 to 20:1, which allows it to support voltages of at least 45 kV and to have resistances of at least 25 MΩ.
An insulating structure of the type that comprises at least a dielectric resin characterized in that comprises at least a first substrate formed from a mixture of thermoset polymer with a dielectric resin in a ratio thermoset polymer/dielectric resin in the scale of 2:1 to 20:1, which allows it to support voltages of at least 45 kV and have resistances of at least 25 MΩ.
Dependencies are inferred from the claim text.